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W9825G6KH-6 Tech Specifications

Winbond  W9825G6KH-6 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 54-TSOP (0.400, 10.16mm Width)
Surface Mount YES
Memory Types Volatile
Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2016
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 54Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
Additional Feature AUTO/SELF REFRESH
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-G54
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Memory Size 256Mb 16M x 16
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Clock Frequency 166MHz
Access Time 5ns
Memory Format DRAM
Memory Interface Parallel
Organization 16MX16
Memory Width 16
Memory Density 268435456 bit
Length 22.22mm
Height Seated (Max) 1.2mm
Width 10.16mm
RoHS Status ROHS3 Compliant
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W9825G6KH-6 Documents

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