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W972GG8JB-25 Tech Specifications

Winbond  W972GG8JB-25 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 60-TFBGA
Number of Pins 60Pins
Memory Types Volatile
Operating Temperature 0°C~85°C TC
Packaging Tray
Published 2011
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 60Terminations
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.36
Voltage - Supply 1.7V~1.9V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 60
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.9V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 2Gb 256M x 8
Number of Ports 1Port
Nominal Supply Current 135mA
Operating Mode SYNCHRONOUS
Clock Frequency 200MHz
Access Time 400ps
Memory Format DRAM
Memory Interface Parallel
Data Bus Width 8b
Organization 256MX8
Output Characteristics 3-STATE
Memory Width 8
Write Cycle Time - Word, Page 15ns
Address Bus Width 18b
Density 2 Gb
Standby Current-Max 0.012A
Max Frequency 800MHz
I/O Type COMMON
Refresh Cycles 8192
Sequential Burst Length 48
Interleaved Burst Length 48
Length 11.5mm
Height Seated (Max) 1.2mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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