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W972GG6KB25I Tech Specifications

Winbond  W972GG6KB25I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 84-TFBGA
Memory Types Volatile
Operating Temperature -40°C~95°C TC
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 84Terminations
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
Voltage - Supply 1.7V~1.9V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B84
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.9V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 2Gb 128M x 16
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Clock Frequency 400MHz
Access Time 400ps
Memory Format DRAM
Memory Interface Parallel
Data Bus Width 16b
Organization 128MX16
Memory Width 16
Write Cycle Time - Word, Page 15ns
Address Bus Width 14b
Density 2 Gb
Length 12.5mm
Height Seated (Max) 1.2mm
RoHS Status ROHS3 Compliant
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