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W9725G8KB25I Tech Specifications

Winbond  W9725G8KB25I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 60-TFBGA
Supplier Device Package 60-WBGA (8x12.5)
Memory Types Volatile
Operating Temperature -40°C~95°C TC
Packaging Tray
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 95°C
Min Operating Temperature -40°C
Voltage - Supply 1.7V~1.9V
Interface Parallel
Memory Size 256Mb 32M x 8
Clock Frequency 200MHz
Access Time 400ps
Memory Format DRAM
Memory Interface Parallel
Write Cycle Time - Word, Page 15ns
RoHS Status ROHS3 Compliant
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W9725G8KB25I Documents

Download datasheets and manufacturer documentation for   W9725G8KB25I

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