W971GG8KB-25 Tech Specifications

Winbond  W971GG8KB-25 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 60-TFBGA
Surface Mount YES
Mounting Type Surface Mount
Memory Types Volatile
Packaging Tray
Published 2016
Operating Temperature 0°C~85°C TC
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 60Terminations
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.32
Voltage - Supply 1.7V~1.9V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 60
JESD-30 Code R-PBGA-B60
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9V
Power Supplies 1.8V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 1Gb 128M x 8
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Clock Frequency 200MHz
Access Time 400ps
Memory Format DRAM
Memory Interface Parallel
Organization 128MX8
Output Characteristics 3-STATE
Memory Width 8
Write Cycle Time - Word, Page 15ns
Memory Density 1073741824 bit
I/O Type COMMON
Refresh Cycles 8192
Sequential Burst Length 48
Interleaved Burst Length 48
Height Seated (Max) 1.2mm
Width 8mm
Length 12.5mm
RoHS Status ROHS3 Compliant
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