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W947D6HBHX6E Tech Specifications

Winbond  W947D6HBHX6E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 60-TFBGA
Number of Pins 60Pins
Memory Types Volatile
Operating Temperature -25°C~85°C TC
Packaging Tray
Published 2011
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 60Terminations
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.02
Voltage - Supply 1.7V~1.95V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 60
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.95V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 128Mb 8M x 16
Number of Ports 1Port
Nominal Supply Current 50mA
Operating Mode SYNCHRONOUS
Clock Frequency 166MHz
Access Time 5ns
Memory Format DRAM
Memory Interface Parallel
Data Bus Width 16b
Organization 8MX16
Output Characteristics 3-STATE
Memory Width 16
Write Cycle Time - Word, Page 15ns
Address Bus Width 14b
Density 128 Mb
Standby Current-Max 0.00001A
I/O Type COMMON
Refresh Cycles 4096
Sequential Burst Length 24816
Interleaved Burst Length 24816
Length 9mm
Height Seated (Max) 1.025mm
RoHS Status ROHS3 Compliant
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