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W947D6HBHX5I Tech Specifications

Winbond  W947D6HBHX5I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 60-TFBGA
Number of Pins 60Pins
Memory Types Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2011
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 60Terminations
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.02
Voltage - Supply 1.7V~1.95V
Terminal Position BOTTOM
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Pin Count 60
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.95V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 128Mb 8M x 16
Number of Ports 1Port
Nominal Supply Current 55mA
Clock Frequency 200MHz
Access Time 5ns
Memory Format DRAM
Memory Interface Parallel
Organization 8MX16
Output Characteristics 3-STATE
Memory Width 16
Write Cycle Time - Word, Page 15ns
Address Bus Width 14b
Density 128 Mb
Standby Current-Max 0.00001A
I/O Type COMMON
Refresh Cycles 4096
Sequential Burst Length 24816
Interleaved Burst Length 24816
Length 9mm
Height Seated (Max) 1.025mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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W947D6HBHX5I Documents

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