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W9464G6KH-5I Tech Specifications

Winbond  W9464G6KH-5I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 66-TSSOP (0.400, 10.16mm Width)
Surface Mount YES
Memory Types Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 66Terminations
Additional Feature AUTO/SELF REFRESH
Voltage - Supply 2.3V~2.7V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 2.5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-G66
Supply Voltage-Max (Vsup) 2.7V
Supply Voltage-Min (Vsup) 2.3V
Memory Size 64Mb 4M x 16
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Clock Frequency 200MHz
Access Time 55ns
Memory Format DRAM
Memory Interface Parallel
Organization 4MX16
Memory Width 16
Write Cycle Time - Word, Page 15ns
Memory Density 67108864 bit
Length 22.22mm
Height Seated (Max) 1.2mm
Width 10.16mm
RoHS Status ROHS3 Compliant
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