W9464G6JH-5 Tech Specifications

Winbond  W9464G6JH-5 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 66-TSSOP (0.400, 10.16mm Width)
Number of Pins 66Pins
Memory Types Volatile
Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2011
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 66Terminations
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.02
Voltage - Supply 2.3V~2.7V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 2.5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 66
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
Supply Voltage-Max (Vsup) 2.7V
Power Supplies 2.6V
Supply Voltage-Min (Vsup) 2.3V
Memory Size 64Mb 4M x 16
Number of Ports 1Port
Nominal Supply Current 100mA
Operating Mode SYNCHRONOUS
Clock Frequency 200MHz
Access Time 55ns
Memory Format DRAM
Memory Interface Parallel
Data Bus Width 16b
Organization 4MX16
Output Characteristics 3-STATE
Memory Width 16
Write Cycle Time - Word, Page 15ns
Address Bus Width 14b
Density 64 Mb
Standby Current-Max 0.005A
I/O Type COMMON
Refresh Cycles 4096
Sequential Burst Length 248
Interleaved Burst Length 248
Length 22.22mm
Height Seated (Max) 1.2mm
RoHS Status ROHS3 Compliant
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