W9464G6JH-4 Tech Specifications

Winbond  W9464G6JH-4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 66-TSSOP (0.400, 10.16mm Width)
Number of Pins 66Pins
Memory Types Volatile
Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2011
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 66Terminations
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.02
Voltage - Supply 2.4V~2.7V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 2.5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 66
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
Supply Voltage-Max (Vsup) 2.7V
Supply Voltage-Min (Vsup) 2.4V
Memory Size 64Mb 4M x 16
Number of Ports 1Port
Nominal Supply Current 110mA
Operating Mode SYNCHRONOUS
Clock Frequency 250MHz
Access Time 55ns
Memory Format DRAM
Memory Interface Parallel
Organization 4MX16
Output Characteristics 3-STATE
Memory Width 16
Write Cycle Time - Word, Page 15ns
Address Bus Width 14b
Density 64 Mb
Standby Current-Max 0.005A
I/O Type COMMON
Refresh Cycles 4096
Sequential Burst Length 248
Interleaved Burst Length 248
Length 22.22mm
Height Seated (Max) 1.2mm
RoHS Status ROHS3 Compliant
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