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W74M64FVSSIQ Tech Specifications

Winbond  W74M64FVSSIQ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PDSO-G8
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 64Mb 8M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 80MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O
Organization 8MX8
Memory Width 8
Memory Density 67108864 bit
Parallel/Serial SERIAL
Programming Voltage 3V
Length 5.28mm
Height Seated (Max) 2.16mm
Width 5.28mm
RoHS Status ROHS3 Compliant
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W74M64FVSSIQ Documents

Download datasheets and manufacturer documentation for   W74M64FVSSIQ

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