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W632GU6NB09I Tech Specifications

Winbond  W632GU6NB09I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 96-VFBGA
Memory Types Volatile
Operating Temperature -40°C~95°C TC
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.283V~1.45V
Memory Size 2Gb 128M x 16
Clock Frequency 1.067GHz
Access Time 20ns
Memory Format DRAM
Memory Interface Parallel
Write Cycle Time - Word, Page 15ns
RoHS Status ROHS3 Compliant
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W632GU6NB09I Documents

Download datasheets and manufacturer documentation for   W632GU6NB09I

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