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W632GU6KB12J Tech Specifications

Winbond  W632GU6KB12J technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 96-TFBGA
Surface Mount YES
Memory Types Volatile
Operating Temperature -40°C~105°C TC
Packaging Tray
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 96Terminations
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
Voltage - Supply 1.283V~1.45V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.35V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B96
Supply Voltage-Max (Vsup) 1.45V
Supply Voltage-Min (Vsup) 1.283V
Memory Size 2Gb 128M x 16
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Clock Frequency 800MHz
Access Time 20ns
Memory Format DRAM
Memory Interface Parallel
Organization 128MX16
Memory Width 16
Memory Density 2147483648 bit
Length 13mm
Height Seated (Max) 1.2mm
Width 9mm
RoHS Status ROHS3 Compliant
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