W632GG6KB-11 Tech Specifications

Winbond  W632GG6KB-11 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 96-TFBGA
Number of Pins 96Pins
Memory Types Volatile
Operating Temperature 0°C~95°C TC
Packaging Tray
Published 2016
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 96Terminations
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.36
Voltage - Supply 1.425V~1.575V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.5V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 96
Qualification Status Not Qualified
Operating Supply Voltage 1.5V
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Memory Size 2Gb 128M x 16
Number of Ports 1Port
Nominal Supply Current 280mA
Operating Mode SYNCHRONOUS
Clock Frequency 933MHz
Access Time 20ns
Memory Format DRAM
Memory Interface Parallel
Organization 128MX16
Output Characteristics 3-STATE
Memory Width 16
Address Bus Width 17b
Density 2 Gb
Standby Current-Max 0.08A
I/O Type COMMON
Refresh Cycles 8192
Sequential Burst Length 8
Interleaved Burst Length 8
Length 13mm
Height Seated (Max) 1.2mm
RoHS Status ROHS3 Compliant
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