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W631GU6KB15I Tech Specifications

Winbond  W631GU6KB15I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 96-TFBGA
Surface Mount YES
Memory Types Volatile
Operating Temperature -40°C~95°C TC
Packaging Tray
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 96Terminations
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.32
Voltage - Supply 1.283V~1.45V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.35V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 96
JESD-30 Code R-PBGA-B96
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.45V
Power Supplies 1.35V
Supply Voltage-Min (Vsup) 1.283V
Memory Size 1Gb 64M x 16
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Clock Frequency 667MHz
Access Time 20ns
Memory Format DRAM
Memory Interface Parallel
Organization 64MX16
Output Characteristics 3-STATE
Memory Width 16
Standby Current-Max 0.014A
Memory Density 1073741824 bit
I/O Type COMMON
Refresh Cycles 8192
Sequential Burst Length 8
Interleaved Burst Length 8
Length 13mm
Height Seated (Max) 1.2mm
Width 9mm
RoHS Status ROHS3 Compliant
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