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W29N02GVBIAF Tech Specifications

Winbond  W29N02GVBIAF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 63-VFBGA
Surface Mount YES
Number of Pins 63Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 63Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 0.8mm
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 2Gb 256M x 8
Operating Mode ASYNCHRONOUS
Memory Format FLASH
Memory Interface Parallel
Organization 256MX8
Memory Width 8
Write Cycle Time - Word, Page 25ns
Memory Density 2147483648 bit
Programming Voltage 3.3V
Length 11mm
Height Seated (Max) 1mm
Width 9mm
RoHS Status ROHS3 Compliant
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W29N02GVBIAF Documents

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