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W29GL512PH9T Tech Specifications

Winbond  W29GL512PH9T technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 56-TFSOP (0.724, 18.40mm Width)
Supplier Device Package 56-TSOP
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2016
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Voltage - Supply 2.7V~3.6V
Interface Parallel
Memory Size 512Mb 64M x 8 32M x 16
Access Time 90ns
Memory Format FLASH
Memory Interface Parallel
Write Cycle Time - Word, Page 90ns
RoHS Status ROHS3 Compliant
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W29GL512PH9T Documents

Download datasheets and manufacturer documentation for   W29GL512PH9T

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