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W29GL256SH9B Tech Specifications

Winbond  W29GL256SH9B technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface Mount YES
Number of Pins 64Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1mm
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 16M x 16
Operating Mode ASYNCHRONOUS
Memory Format FLASH
Memory Interface Parallel
Organization 16MX16
Memory Width 16
Write Cycle Time - Word, Page 90ns
Standby Current-Max 0.0001A
Memory Density 268435456 bit
Access Time (Max) 90 ns
Programming Voltage 3V
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256Sectors/Sizes
Sector Size 64K
Page Size 16words
Ready/Busy YES
Common Flash Interface YES
Length 13mm
Height Seated (Max) 1.4mm
Width 11mm
RoHS Status ROHS3 Compliant
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W29GL256SH9B Documents

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