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W29GL256PH9T Tech Specifications

Winbond  W29GL256PH9T technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 56-TFSOP (0.724, 18.40mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 56Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-G56
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 32M x 8 16M x 16
Operating Mode ASYNCHRONOUS
Memory Format FLASH
Memory Interface Parallel
Organization 16MX16
Memory Width 16
Write Cycle Time - Word, Page 90ns
Memory Density 268435456 bit
Access Time (Max) 90 ns
Programming Voltage 3V
Alternate Memory Width 8
Length 18.4mm
Height Seated (Max) 1.2mm
Width 14mm
RoHS Status ROHS3 Compliant
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W29GL256PH9T Documents

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