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W29GL128CH9C Tech Specifications

Winbond  W29GL128CH9C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 56-TFBGA
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 56Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 0.8mm
JESD-30 Code R-PBGA-B56
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 128Mb 16M x 8 8M x 16
Operating Mode ASYNCHRONOUS
Memory Format FLASH
Memory Interface Parallel
Organization 8MX16
Memory Width 16
Write Cycle Time - Word, Page 90ns
Standby Current-Max 0.000005A
Memory Density 134217728 bit
Access Time (Max) 90 ns
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 128Sectors/Sizes
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Length 9mm
Height Seated (Max) 1.2mm
Width 7mm
RoHS Status ROHS3 Compliant
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W29GL128CH9C Documents

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