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W29GL032CT7S Tech Specifications

Winbond  W29GL032CT7S technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Supplier Device Package 48-TSOP
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Voltage - Supply 2.7V~3.6V
Interface Parallel
Memory Size 32Mb 4M x 8 2M x 16
Access Time 70ns
Memory Format FLASH
Memory Interface Parallel
Write Cycle Time - Word, Page 70ns
RoHS Status ROHS3 Compliant
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W29GL032CT7S Documents

Download datasheets and manufacturer documentation for   W29GL032CT7S

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