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W25X32VSFIG Tech Specifications

Winbond  W25X32VSFIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295, 7.50mm Width)
Number of Pins 16Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2007
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16Terminations
ECCN Code 3A991.B.1.A
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.51
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 16
Qualification Status Not Qualified
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 32Mb 4M x 8
Nominal Supply Current 18mA
Clock Frequency 75MHz
Access Time 7 ns
Memory Format FLASH
Memory Interface SPI
Organization 4MX8
Memory Width 8
Write Cycle Time - Word, Page 3ms
Address Bus Width 24b
Density 32 Mb
Standby Current-Max 0.00001A
Sync/Async Synchronous
Word Size 8b
Programming Voltage 2.7V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Alternate Memory Width 1
Length 10.285mm
Height Seated (Max) 2.64mm
RoHS Status ROHS3 Compliant
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