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W25X10CLZPIG Tech Specifications

Winbond  W25X10CLZPIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
Voltage - Supply 2.3V~3.6V
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Pin Count 8
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 1Mb 128K x 8
Nominal Supply Current 14mA
Clock Frequency 104MHz
Access Time 8 ns
Memory Format FLASH
Memory Interface SPI
Organization 1MX1
Memory Width 1
Write Cycle Time - Word, Page 800μs
Address Bus Width 24b
Density 1 Mb
Sync/Async Synchronous
Programming Voltage 3V
Length 6mm
RoHS Status ROHS3 Compliant
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W25X10CLZPIG Documents

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