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W25X10BVZPIG Tech Specifications

Winbond  W25X10BVZPIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2012
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code EAR99
HTS Code 8542.32.00.51
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Pin Count 8
JESD-30 Code R-PDSO-N8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 1Mb 128K x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI
Organization 1MX1
Memory Width 1
Write Cycle Time - Word, Page 3ms
Standby Current-Max 0.000005A
Memory Density 1048576 bit
Programming Voltage 2.7V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 6mm
Height Seated (Max) 0.8mm
Width 5mm
RoHS Status ROHS3 Compliant
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W25X10BVZPIG Documents

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