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W25Q80EWZPIG Tech Specifications

Winbond  W25Q80EWZPIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 1.65V~1.95V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.95V
Supply Voltage-Min (Vsup) 1.65V
Interface SPI, Serial
Memory Size 8Mb 1M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Access Time 6 ns
Memory Format FLASH
Memory Interface SPI
Memory Width 1
Write Cycle Time - Word, Page 800μs
Density 64 Mb
Standby Current-Max 0.0000075A
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Page Size 256B
Length 6mm
Width 5mm
RoHS Status ROHS3 Compliant
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W25Q80EWZPIG Documents

Download datasheets and manufacturer documentation for   W25Q80EWZPIG

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