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W25Q64FWSSIG Tech Specifications

Winbond  W25Q64FWSSIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
JESD-609 Code e3
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Terminal Finish Tin (Sn)
Voltage - Supply 1.65V~1.95V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Pin Count 8
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.95V
Supply Voltage-Min (Vsup) 1.65V
Memory Size 64Mb 8M x 8
Nominal Supply Current 20mA
Clock Frequency 104MHz
Access Time 6 ns
Memory Format FLASH
Memory Interface SPI
Organization 64MX1
Memory Width 1
Write Cycle Time - Word, Page 5ms
Address Bus Width 24b
Density 64 Mb
Standby Current-Max 0.00002A
Parallel/Serial SERIAL
Sync/Async Synchronous
Word Size 8b
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Ambient Temperature Range High 85°C
Height 2.16mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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W25Q64FWSSIG Documents

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