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W25Q64FVZPIG Tech Specifications

Winbond  W25Q64FVZPIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2011
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Terminal Pitch 1.27mm
Operating Supply Voltage 3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Interface SPI
Memory Size 64Mb 8M x 8
Nominal Supply Current 40mA
Clock Frequency 104MHz
Access Time 7 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Output Characteristics 3-STATE
Memory Width 8
Write Cycle Time - Word, Page 50μs, 3ms
Address Bus Width 1b
Density 64 Mb
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
Sync/Async Synchronous
Word Size 8b
Serial Bus Type SPI
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Alternate Memory Width 1
Page Size 256B
Ambient Temperature Range High 85°C
Height 800μm
Length 6mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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W25Q64FVZPIG Documents

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