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W25Q512JVEIM Tech Specifications

Winbond  W25Q512JVEIM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Series SpiFlash®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Reach Compliance Code compliant
JESD-30 Code R-PDSO-N8
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 512Mb 64M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 133MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O
Organization 64MX8
Memory Width 8
Memory Density 536870912 bit
Parallel/Serial SERIAL
Programming Voltage 3V
Alternate Memory Width 1
Length 8mm
Height Seated (Max) 0.8mm
Width 6mm
RoHS Status RoHS Compliant
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W25Q512JVEIM Documents

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