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W25Q32FVSSIP Tech Specifications

Winbond  W25Q32FVSSIP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Package / Case 8-SOIC (0.209, 5.30mm Width)
Mounting Type Surface Mount
Memory Types Non-Volatile
Published 2016
Series SpiFlash®
Packaging Tube
Operating Temperature -40°C~85°C TA
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
JESD-30 Code S-PDSO-G8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 32Mb 4M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Supply Current-Max 0.02mA
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 32MX1
Memory Width 1
Write Cycle Time - Word, Page 50μs, 3ms
Standby Current-Max 0.00002A
Memory Density 33554432 bit
Programming Voltage 2.7V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 5.23mm
Width 5.23mm
Height Seated (Max) 2.16mm
RoHS Status ROHS3 Compliant
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W25Q32FVSSIP Documents

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