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W25Q32DWSFIG Tech Specifications

Winbond  W25Q32DWSFIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295, 7.50mm Width)
Number of Pins 16Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2012
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16Terminations
ECCN Code EAR99
Additional Feature TOP/BOTTOM BOOT BLOCK
HTS Code 8542.32.00.51
Voltage - Supply 1.7V~1.95V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Pin Count 16
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.95V
Supply Voltage-Min (Vsup) 1.7V
Interface SPI, Serial
Memory Size 32Mb 4M x 8
Nominal Supply Current 40mA
Clock Frequency 104MHz
Access Time 7.5 ns
Memory Format FLASH
Memory Interface SPI
Memory Width 16
Write Cycle Time - Word, Page 3ms
Address Bus Width 24b
Density 32 Mb
Standby Current-Max 0.00002A
Sync/Async Synchronous
Word Size 8b
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 10.31mm
Height Seated (Max) 2.64mm
RoHS Status ROHS3 Compliant
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