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W25Q32BVTBJP Tech Specifications

Winbond  W25Q32BVTBJP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 24-TBGA
Memory Types Non-Volatile
Operating Temperature -40°C~105°C TA
Packaging Tube
Series SpiFlash®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.7V~3.6V
Memory Size 32Mb 4M x 8
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O
Write Cycle Time - Word, Page 50μs, 3ms
RoHS Status ROHS3 Compliant
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W25Q32BVTBJP Documents

Download datasheets and manufacturer documentation for   W25Q32BVTBJP

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