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W25Q32BVSFJG Tech Specifications

Winbond  W25Q32BVSFJG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 16-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Memory Types Non-Volatile
Usage Level Automotive grade
Operating Temperature -40°C~105°C TA
Packaging Tube
Series SpiFlash®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
JESD-30 Code R-PDSO-G16
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 32Mb 4M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O
Organization 4MX8
Memory Width 8
Write Cycle Time - Word, Page 50μs, 3ms
Memory Density 33554432 bit
Screening Level AEC-Q100
Parallel/Serial SERIAL
Programming Voltage 2.7V
Length 10.31mm
Height Seated (Max) 2.64mm
Width 7.49mm
RoHS Status ROHS3 Compliant
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W25Q32BVSFJG Documents

Download datasheets and manufacturer documentation for   W25Q32BVSFJG

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