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W25Q257FVFIQ Tech Specifications

Winbond  W25Q257FVFIQ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295, 7.50mm Width)
Supplier Device Package 16-SOIC
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Voltage - Supply 2.7V~3.6V
Frequency 104MHz
Interface SPI, Serial
Memory Size 256Mb 32M x 8
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Write Cycle Time - Word, Page 50μs, 3ms
RoHS Status ROHS3 Compliant
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W25Q257FVFIQ Documents

Download datasheets and manufacturer documentation for   W25Q257FVFIQ

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