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- W25Q256JVBIM
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W25Q256JVBIM Tech Specifications
Winbond W25Q256JVBIM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 10 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 24-TBGA | |
| Surface Mount | YES | |
| Memory Types | Non-Volatile | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tray | |
| Series | SpiFlash® | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 24Terminations | |
| Voltage - Supply | 2.7V~3.6V | |
| Terminal Position | BOTTOM | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 3V | |
| Terminal Pitch | 1mm | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-PBGA-B24 | |
| Supply Voltage-Max (Vsup) | 3.6V | |
| Supply Voltage-Min (Vsup) | 2.7V | |
| Memory Size | 256Mb 32M x 8 | |
| Operating Mode | SYNCHRONOUS | |
| Clock Frequency | 133MHz | |
| Memory Format | FLASH | |
| Memory Interface | SPI - Quad I/O | |
| Organization | 32MX8 | |
| Memory Width | 8 | |
| Write Cycle Time - Word, Page | 3ms | |
| Memory Density | 268435456 bit | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3V | |
| Length | 8mm | |
| Height Seated (Max) | 1.2mm | |
| Width | 6mm | |
| RoHS Status | ROHS3 Compliant |
W25Q256JVBIM Documents
Download datasheets and manufacturer documentation for W25Q256JVBIM
- DatasheetsW25Q256JV
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