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W25Q256FVFIP Tech Specifications

Winbond  W25Q256FVFIP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 16-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
JESD-30 Code R-PDSO-G16
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 32M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 50μs, 3ms
Standby Current-Max 0.00002A
Memory Density 268435456 bit
Parallel/Serial SERIAL
Programming Voltage 3V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 10.31mm
Height Seated (Max) 2.64mm
Width 7.49mm
RoHS Status ROHS3 Compliant
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W25Q256FVFIP Documents

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