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W25Q256FVCIG Tech Specifications

Winbond  W25Q256FVCIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 24-TBGA
Surface Mount YES
Number of Pins 24Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 24Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1mm
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 256Mb 32M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 50μs, 3ms
Standby Current-Max 0.000025A
Memory Density 268435456 bit
Programming Voltage 3V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 8mm
Height Seated (Max) 1.2mm
Width 6mm
RoHS Status ROHS3 Compliant
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W25Q256FVCIG Documents

Download datasheets and manufacturer documentation for   W25Q256FVCIG

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