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W25Q256FVBJQ Tech Specifications

Winbond  W25Q256FVBJQ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 24-TBGA
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~105°C TA
Packaging Tube
Series SpiFlash®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 24Terminations
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B24
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 32M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 50μs, 3ms
Memory Density 268435456 bit
Parallel/Serial SERIAL
Programming Voltage 3V
Length 8mm
Height Seated (Max) 1.2mm
Width 6mm
RoHS Status ROHS3 Compliant
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