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W25Q20EWSNIG Tech Specifications

Winbond  W25Q20EWSNIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Series SpiFlash®
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 1.65V~1.95V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 1.27mm
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95V
Power Supplies 1.8V
Supply Voltage-Min (Vsup) 1.65V
Interface SPI, Serial
Memory Size 2Mb 256K x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI
Organization 2MX1
Memory Width 1
Write Cycle Time - Word, Page 800μs
Standby Current-Max 0.0000075A
Memory Density 2097152 bit
Programming Voltage 1.8V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 4.85mm
Height Seated (Max) 1.75mm
Width 3.9mm
RoHS Status ROHS3 Compliant
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W25Q20EWSNIG Documents

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