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W25Q16FWSNIQ Tech Specifications

Winbond  W25Q16FWSNIQ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Series SpiFlash®
Published 2017
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 1.65V~1.95V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 1.27mm
JESD-30 Code R-PDSO-G8
Supply Voltage-Max (Vsup) 1.95V
Supply Voltage-Min (Vsup) 1.65V
Interface SPI, Serial
Memory Size 16Mb 2M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 16MX1
Memory Width 1
Write Cycle Time - Word, Page 60μs, 3ms
Memory Density 16777216 bit
Programming Voltage 1.8V
Length 4.9mm
Height Seated (Max) 1.75mm
Width 3.9mm
RoHS Status ROHS3 Compliant
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W25Q16FWSNIQ Documents

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