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W25Q16DWUUIG Tech Specifications

Winbond  W25Q16DWUUIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 8-UDFN Exposed Pad
Surface Mount YES
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series SpiFlash®
Published 2010
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 1.65V~1.95V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.8V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage-Max (Vsup) 1.95V
Supply Voltage-Min (Vsup) 1.7V
Interface SPI, Serial
Memory Size 16Mb 2M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 16MX1
Memory Width 1
Write Cycle Time - Word, Page 40μs, 3ms
Memory Density 16777216 bit
Length 4mm
Height Seated (Max) 0.6mm
Width 3mm
RoHS Status ROHS3 Compliant
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W25Q16DWUUIG Documents

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