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W25Q16DWSSIG Tech Specifications

Winbond  W25Q16DWSSIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code EAR99
HTS Code 8542.32.00.51
Voltage - Supply 1.65V~1.95V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Pin Count 8
JESD-30 Code S-PDSO-G8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95V
Power Supplies 1.8V
Supply Voltage-Min (Vsup) 1.65V
Interface SPI, Serial
Memory Size 16Mb 2M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 16MX1
Memory Width 1
Write Cycle Time - Word, Page 40μs, 3ms
Standby Current-Max 0.000005A
Memory Density 16777216 bit
Programming Voltage 1.8V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 5.23mm
Height Seated (Max) 2.16mm
Width 5.23mm
RoHS Status ROHS3 Compliant
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W25Q16DWSSIG Documents

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