W25Q128FVFIG Tech Specifications

Winbond  W25Q128FVFIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295, 7.50mm Width)
Number of Pins 16Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2012
JESD-609 Code e3
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16Terminations
ECCN Code 3A991.B.1.A
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.51
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Pin Count 16
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI
Memory Size 128Mb 16M x 8
Nominal Supply Current 20mA
Clock Frequency 104MHz
Access Time 7 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 128MX1
Memory Width 1
Write Cycle Time - Word, Page 50μs, 3ms
Address Bus Width 24b
Density 128 Mb
Standby Current-Max 0.00002A
Parallel/Serial SERIAL
Sync/Async Synchronous
Word Size 8b
Programming Voltage 3V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Ambient Temperature Range High 85°C
Height 2.64mm
Length 10.31mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
View Similar

W25Q128FVFIG Documents

Download datasheets and manufacturer documentation for   W25Q128FVFIG

W25Q128FVFIG brand manufacturers: Winbond Electronics, Twicea stock, W25Q128FVFIG reference price.Winbond Electronics. W25Q128FVFIG parameters, W25Q128FVFIG Datasheet PDF and pin diagram description download.You can use the W25Q128FVFIG Memory, DSP Datesheet PDF, find W25Q128FVFIG pin diagram and circuit diagram and usage method of function,W25Q128FVFIG electronics tutorials.You can download from the Twicea.