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W25Q128FVEIF Tech Specifications

Winbond  W25Q128FVEIF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2012
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code EAR99
HTS Code 8542.32.00.51
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
JESD-30 Code R-PDSO-N8
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 128Mb 16M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 16MX8
Memory Width 8
Write Cycle Time - Word, Page 50μs, 3ms
Memory Density 134217728 bit
Programming Voltage 3V
Length 8mm
Height Seated (Max) 0.8mm
Width 6mm
RoHS Status ROHS3 Compliant
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W25Q128FVEIF Documents

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