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W25Q128FVBIG Tech Specifications

Winbond  W25Q128FVBIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 24-TBGA
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 24Terminations
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1mm
Pin Count 24
JESD-30 Code R-PBGA-B24
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 128Mb 16M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 128MX1
Memory Width 1
Write Cycle Time - Word, Page 50μs, 3ms
Standby Current-Max 0.00002A
Memory Density 134217728 bit
Parallel/Serial SERIAL
Programming Voltage 3V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 8mm
Height Seated (Max) 1.2mm
Width 6mm
RoHS Status ROHS3 Compliant
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W25Q128FVBIG Documents

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