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W25M02GVZEIG TR Tech Specifications

Winbond  W25M02GVZEIG TR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6)
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series SpiFlash®
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.7V~3.6V
Memory Size 2Gb 256M x 8
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI
Write Cycle Time - Word, Page 700μs
RoHS Status ROHS3 Compliant
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W25M02GVZEIG TR Documents

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