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W66BP6NBUAFJ Tech Specifications

Winbond  W66BP6NBUAFJ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Interface Type Low Power DDR4/4X SDRAM
Dimensions 10X14.5mm2
I/O 16BIT
Package WFBGA - 200
Frequency 3200/3733/4267MbpsMHz
Voltage 1.06 ~ 1.17V
Density 2Gb
Temperature -40~105˚C
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W66BP6NBUAFJ Documents

Download datasheets and manufacturer documentation for   W66BP6NBUAFJ

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