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W25Q01JVTBIQ Tech Specifications

Winbond  W25Q01JVTBIQ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Dimensions 6X8mm2
Package TFBGA - 24
Frequency 133MHz
Voltage 2.7 ~ 3.6V
Density 1Gb
Temperature -40~+85˚C
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W25Q01JVTBIQ Documents

Download datasheets and manufacturer documentation for   W25Q01JVTBIQ

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