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ISD4003-08MEI Tech Specifications

Winbond  ISD4003-08MEI technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 28Terminals
Package Description TSSOP, TSSOP28,.53,22
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TSSOP28,.53,22
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Manufacturer Part Number ISD4003-08MEI
Package Code TSSOP
Package Shape RECTANGULAR
Manufacturer Nuvoton Technology Corp
Part Life Cycle Code Obsolete
Ihs Manufacturer NUVOTON TECHNOLOGY CORP
Risk Rank 5.53
Subcategory Audio Synthesizer ICs
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Terminal Pitch 0.55 mm
Reach Compliance Code compliant
JESD-30 Code R-PDSO-G28
Qualification Status Not Qualified
Power Supplies 3 V
Temperature Grade INDUSTRIAL
Supply Current-Max 40 mA
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG
Reading Time-Max 480 s
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