ISD2560PY Tech Specifications

Winbond  ISD2560PY technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type SMD
Surface Mount NO
Number of Terminals 28Terminals
Core Material Ferrite
MSL n/a
Shield Unshielded
RoHS Yes
Package Description DIP, DIP28,.6
Package Style IN-LINE
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP28,.6
Rohs Code Yes
Manufacturer Part Number ISD2560PY
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Nuvoton Technology Corp
Part Life Cycle Code Obsolete
Ihs Manufacturer NUVOTON TECHNOLOGY CORP
Risk Rank 5.79
Operating Temperature -40...+85°C
Series 1210F
Tolerance ±5 %
Subcategory Audio Synthesizer ICs
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
JESD-30 Code R-PDIP-T28
Qualification Status Not Qualified
Power Supplies 5 V
Note n/a
Inductance 6,8 uH
Test Frequency 1 MHz
Supply Current-Max 30 mA
Size 1210
Self Resonant Frequency 28 MHz
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG
Features -
Reading Time-Max 60 s
Lead Free Lead Free
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