BYC8X-600P,127 Tech Specifications

WeEn Semiconductors  BYC8X-600P,127 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Package / Case TO-220-2 Full Pack, Isolated Tab
Surface Mount NO
Diode Element Material SILICON
Number of Elements 1 Element
Operating Temperature (Max.) 175°C
Packaging Tube
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Terminal Finish Tin (Sn)
Applications HYPER FAST RECOVERY POWER
Additional Feature LOW LEAKAGE CURRENT
Terminal Position SINGLE
Reach Compliance Code not_compliant
Base Part Number BYC8-600
Reference Standard IEC-60134
JESD-30 Code R-PSFM-T2
Configuration SINGLE
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 20μA @ 600V
Voltage - Forward (Vf) (Max) @ If 1.9V @ 8A
Operating Temperature - Junction 175°C Max
Voltage - DC Reverse (Vr) (Max) 600V
Current - Average Rectified (Io) 8A
Number of Phases 1Phase
Reverse Recovery Time 18ns
Rep Pk Reverse Voltage-Max 600V
JEDEC-95 Code TO-220AC
Non-rep Pk Forward Current-Max 100A
Reverse Current-Max 20μA
RoHS Status RoHS Compliant
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